|
Effect of cooling condition and Ag on the growth of intermetallic compounds in Sn-based solder joints |
|
|
|
Titel: |
Effect of cooling condition and Ag on the growth of intermetallic compounds in Sn-based solder joints |
Auteur: |
Ma, Haoran Kunwar, Anil Guo, Bingfeng Sun, Junhao Jiang, Chengrong Wang, Yunpeng Song, Xueguan Zhao, Ning Ma, Haitao |
Verschenen in: |
Applied physics. Part A, Materials science and processing |
Paginering: |
Jaargang 122 (2016) nr. 12 pagina's 1-10 |
Jaar: |
2016 |
Inhoud: |
|
Uitgever: |
Springer Berlin Heidelberg, Berlin/Heidelberg |
Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
|
|
|
|