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                                       Details for article 8 of 22 found articles
 
 
  Effect of Wafer Temperature on High Aspect Ratio Hardmask Etching
 
 
Title: Effect of Wafer Temperature on High Aspect Ratio Hardmask Etching
Author: Lee, S.
Tien, Y.-C.
Chang, Y.-W.
Appeared in: Plasma chemistry and plasma processing
Paging: Volume 22 (2002) nr. 4 pages 627-637
Year: 2002
Contents:
Publisher: Kluwer Academic Publishers-Plenum Publishers, New York
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 8 of 22 found articles
 
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