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                                       Details for article 6 of 6 found articles
 
 
  Reliability-aware platform optimization for 3D chip multi-processors
 
 
Title: Reliability-aware platform optimization for 3D chip multi-processors
Author: Kdouh, Wael
El-Rewini, Hesham
Appeared in: The Journal of supercomputing
Paging: Volume 60 (2011) nr. 2 pages 248-267
Year: 2011
Contents:
Publisher: Springer US, Boston
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 6 of 6 found articles
 
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