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A reactive modifier that enhances the thermal mechanical properties of epoxy resin through the formation of multiple hydrogen-bonded network |
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Title: |
A reactive modifier that enhances the thermal mechanical properties of epoxy resin through the formation of multiple hydrogen-bonded network |
Author: |
Juang, Tzong-Yuan Liu, Jene-Ku Chang, Chia-Cheng Shau, Shi-Min Tsai, Mei-Hui Dai, Shenghong A. Su, Wen-Chiung Lin, Ching-Hsuan Jeng, Ru-Jong |
Appeared in: |
Journal of polymer research |
Paging: |
Volume 18 (2010) nr. 5 pages 1169-1176 |
Year: |
2010 |
Contents: |
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Publisher: |
Springer Netherlands, Dordrecht |
Source file: |
Elektronische Wetenschappelijke Tijdschriften |
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