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                                       Details for article 3 of 45 found articles
 
 
  A reactive modifier that enhances the thermal mechanical properties of epoxy resin through the formation of multiple hydrogen-bonded network
 
 
Title: A reactive modifier that enhances the thermal mechanical properties of epoxy resin through the formation of multiple hydrogen-bonded network
Author: Juang, Tzong-Yuan
Liu, Jene-Ku
Chang, Chia-Cheng
Shau, Shi-Min
Tsai, Mei-Hui
Dai, Shenghong A.
Su, Wen-Chiung
Lin, Ching-Hsuan
Jeng, Ru-Jong
Appeared in: Journal of polymer research
Paging: Volume 18 (2010) nr. 5 pages 1169-1176
Year: 2010
Contents:
Publisher: Springer Netherlands, Dordrecht
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 3 of 45 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands