Post-annealing of hybrid SAC305-SnBi solder joints formed with a 150 °C reflow to improve fatigue resistance
Titel:
Post-annealing of hybrid SAC305-SnBi solder joints formed with a 150 °C reflow to improve fatigue resistance
Auteur:
Das, Ronit Mahmood, Atif Thekkut, Sanoop Munnangi, Sai Kiran Reddy Semndili, Anola Sivasubramony, Rajesh Sharma Yadav, Manu Assiedu, Jones Gharaibeh, Mohammad A. Arroyo, Carlos Sharma, Gaurav Borgesen, Peter
Verschenen in:
Journal of materials science. Materials in electronics