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Details for article 31 of 61 found articles
| Title: |
Lowering temperature of Cu sinter bonding under low-pressure in ambient air by in-situ generation and reduction of Cu2O nanoparticles |
| Author: |
Oba, Miwa Matsuda, Tomoki Dougakiuchi, Masashi Okubo, Shio Kambara, Makoto |
| Appeared in: |
Journal of materials science. Materials in electronics |
| Paging: | Volume 36 () nr. 4 pages xx |
| Year: |
2025-02-10 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 31 of 61 found articles
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