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Journal description
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Details for article 58 of 87 found articles
| Title: |
Microstructure and mechanical properties of Cu/In–Zn–Sn–Bi/Cu joints bonded with high-entropy alloy solder at ultra-low temperature |
| Author: |
Wu, Guodong Shen, Jingfang Muhammad, Khairi Faiz Zhou, Ding Wong, Yew Hoong Si, Zhixiang |
| Appeared in: |
Journal of materials science. Materials in electronics |
| Paging: | Volume 36 () nr. 16 pages xx |
| Year: |
2025-05-31 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 58 of 87 found articles
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