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Details for article 21 of 86 found articles
| Title: |
Effect of thickness in the SAC 305 plated layer on the interfacial reaction and mechanical properties of the CCSB joint assembled onto the OSP surface finished FR-4 PCB board |
| Author: |
Son, Jae-yeol Kang, Donggil Jeong, Haksan Jung, Seung-Boo |
| Appeared in: |
Journal of materials science. Materials in electronics |
| Paging: | Volume 35 () nr. 7 pages xx |
| Year: |
2024-02-29 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 21 of 86 found articles
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