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Journal description
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Details for article 45 of 69 found articles
| Title: |
Low-temperature lead-free SnBiIn solder for electronic packaging |
| Author: |
Zhang, Shannan Long, Weimin Li, Peiyan Liu, Fuli Xue, Hangyan Ding, Tianran |
| Appeared in: |
Journal of materials science. Materials in electronics |
| Paging: | Volume 35 () nr. 10 pages xx |
| Year: |
2024-04-02 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 45 of 69 found articles
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