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Journal description
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Details for article 22 of 50 found articles
| Title: |
Evolution of epoxy molding compounds and future carbon materials for thermal and mechanical stress management in memory device packaging: a critical review |
| Author: |
Gan, Chong Leong Chung, Min-Hua Lin, Lu-Fu Huang, Chen-Yu Takiar, Hem |
| Appeared in: |
Journal of materials science. Materials in electronics |
| Paging: | Volume 34 () nr. 30 pages xx |
| Year: |
2023-10-23 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 22 of 50 found articles
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