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Journal description
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Details for article 46 of 46 found articles
| Title: |
Wetting behavior of eutectic Au–Sn solder on Ni/Au metallization at different temperatures |
| Author: |
Wang, Jie Wu, Yiping Chen, Weimin Xie, Yangquan |
| Appeared in: |
Journal of materials science. Materials in electronics |
| Paging: | Volume 33 () nr. 4 pages 1774-1782 |
| Year: |
2022-01-23 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 46 of 46 found articles
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