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Details for article 50 of 60 found articles
| Title: |
Severe embrittlement of copper pillar bumps electrodeposited using JGB as leveler |
| Author: |
Ding, Zi-feng Wang, Xiao-jing Wang, Wen-dong Cai, Shan-shan Guo, Jing-dong Zhu, Qing-sheng |
| Appeared in: |
Journal of materials science. Materials in electronics |
| Paging: | Volume 33 () nr. 24 pages 19026-19035 |
| Year: |
2022-08-04 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 50 of 60 found articles
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