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Details for article 4 of 45 found articles
| Title: |
Anti-oxidative copper nanoparticle paste for Cu–Cu bonding at low temperature in air |
| Author: |
Wang, Xiaocun Zhang, Zhaoqiang Feng, Yunya Xiao, Fei |
| Appeared in: |
Journal of materials science. Materials in electronics |
| Paging: | Volume 33 () nr. 2 pages 817-827 |
| Year: |
2021-11-23 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 4 of 45 found articles
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