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Journal description
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Details for article 79 of 82 found articles
| Title: |
Thermomigration behavior of Sn–Bi joints under different substrate |
| Author: |
Wu, Jun Wang, Kaipeng Wang, Fengjiang Liao, Mingqing |
| Appeared in: |
Journal of materials science. Materials in electronics |
| Paging: | Volume 33 () nr. 10 pages 8127-8139 |
| Year: |
2022-03-02 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 79 of 82 found articles
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