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The effects of the addition of CNT@Ni on the hardness, density, wettability and mechanical properties of Sn-0.7Cu lead-free solder |
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Titel: |
The effects of the addition of CNT@Ni on the hardness, density, wettability and mechanical properties of Sn-0.7Cu lead-free solder |
Auteur: |
Mao, Jun Yang, Wenchao Song, Qianqian Lv, Yang Jiang, Shiwei Li, Yitai Zhan, Yongzhong |
Verschenen in: |
Journal of materials science. Materials in electronics |
Paginering: |
Jaargang 32 () nr. 8 pagina's 10843-10854 |
Jaar: |
2021-04-05 |
Inhoud: |
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Uitgever: |
Springer US, New York |
Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
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