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Journal description
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Details for article 33 of 124 found articles
| Title: |
Effect of temperature on the electrical conduction and dielectric behavior of solder |
| Author: |
Yang, Wenyi Chung, D. D. L. |
| Appeared in: |
Journal of materials science. Materials in electronics |
| Paging: | Volume 32 () nr. 5 pages 6511-6519 |
| Year: |
2021-02-08 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 33 of 124 found articles
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