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Details for article 71 of 76 found articles
| Title: |
The effect of alkaline earth additions on the physical property and the corrosion behavior of Sn-0.7Cu-0.075Al solder alloy |
| Author: |
Qi, Da Du, Zaixiang Fu, Yaokun Jiang, Shiwei Liu, Dianfang Yang, Wenchao Zhan, Yongzhong |
| Appeared in: |
Journal of materials science. Materials in electronics |
| Paging: | Volume 32 () nr. 19 pages 24152-24167 |
| Year: |
2021-08-31 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 71 of 76 found articles
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