In-situ thin film copper–copper thermocompression bonding for quantum cascade lasers
Titel:
In-situ thin film copper–copper thermocompression bonding for quantum cascade lasers
Auteur:
Rouhi, Sina Ozdemir, Mehtap Ekmekcioglu, Merve Yigen, Serap Demirhan, Yasemin Szerling, Anna Kosiel, Kamil Kozubal, Maciej Kruszka, Renata Prokaryn, Piotr Ertugrul, Mehmet Reno, John L. Aygun, Gulnur Ozyuzer, Lutfi
Verschenen in:
Journal of materials science. Materials in electronics