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Journal description
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Details for article 56 of 100 found articles
| Title: |
Mechanical properties and microstructural evolution of solder alloys fabricated using laser-assisted bonding |
| Author: |
Joo, Hong-Sub Lee, Choong-Jae Min, Kyung Deuk Hwang, Byeong-Uk Jung, Seung-Boo |
| Appeared in: |
Journal of materials science. Materials in electronics |
| Paging: | Volume 31 () nr. 24 pages 22926-22932 |
| Year: |
2020-11-15 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 56 of 100 found articles
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