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Journal description
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Details for article 37 of 90 found articles
| Title: |
Experimental investigations in the intermetallic and microvoid formation in sub-200 °C Cu–Sn bonding |
| Author: |
Kannojia, Harindra Kumar Dixit, Pradeep |
| Appeared in: |
Journal of materials science. Materials in electronics |
| Paging: | Volume 30 (2019) nr. 17 pages 16427-16438 |
| Year: |
2019 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 37 of 90 found articles
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