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Low temperature bonding with high shear strength using micro-sized Ag particle paste for power electronic packaging |
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Titel: |
Low temperature bonding with high shear strength using micro-sized Ag particle paste for power electronic packaging |
Auteur: |
Roh, Myong-Hoon Nishikawa, Hiroshi Tsutsumi, Seiichiro Nishiwaki, Naruhiko Ito, Keiichi Ishikawa, Koji Katsuya, Akihiro Kamada, Nobuo Saito, Mutsuo |
Verschenen in: |
Journal of materials science. Materials in electronics |
Paginering: |
Jaargang 29 (2017) nr. 5 pagina's 3800-3807 |
Jaar: |
2017 |
Inhoud: |
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Uitgever: |
Springer US, New York |
Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
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