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Journal description
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Details for article 60 of 100 found articles
| Title: |
Nanoindentation creep on Cu3Sn, Cu6Sn5 and (Cu, Ni)6Sn5 intermetallic compounds grown in electrodeposited multilayered thin film |
| Author: |
Haseeb, A. S. M. A. Rahman, Abu Zayed Mohammad Saliqur Chia, Pay Ying |
| Appeared in: |
Journal of materials science. Materials in electronics |
| Paging: | Volume 29 (2017) nr. 2 pages 1258-1263 |
| Year: |
2017 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 60 of 100 found articles
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