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Journal description
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Details for article 52 of 101 found articles
| Title: |
Mechanical reliability of transient liquid phase bonding of Au–Sn solder with Ni(Cu) substrates |
| Author: |
Peng, J. Wang, R. C. Liu, H. S. Li, J. Y. |
| Appeared in: |
Journal of materials science. Materials in electronics |
| Paging: | Volume 29 (2017) nr. 1 pages 313-322 |
| Year: |
2017 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 52 of 101 found articles
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