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Journal description
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Details for article 18 of 75 found articles
| Title: |
Enhancement of optical performance of the light emitting diode packages with advanced thermal design of die-attaching layers |
| Author: |
Chu, Kunmo Lee, Changseung Park, Sung-Hoon Sohn, Yoonchul |
| Appeared in: |
Journal of materials science. Materials in electronics |
| Paging: | Volume 28 (2016) nr. 7 pages 5174-5179 |
| Year: |
2016 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 18 of 75 found articles
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