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Journal description
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Details for article 57 of 103 found articles
| Title: |
Low temperature Cu–Cu bonding by transient liquid phase sintering of mixed Cu nanoparticles and Sn–Bi eutectic powders |
| Author: |
Khairi Faiz, M. Bansho, Kazuma Suga, Tadatomo Miyashita, Tomoyuki Yoshida, Makoto |
| Appeared in: |
Journal of materials science. Materials in electronics |
| Paging: | Volume 28 (2017) nr. 21 pages 16433-16443 |
| Year: |
2017 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 57 of 103 found articles
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