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Journal description
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Details for article 40 of 103 found articles
| Title: |
Flip-chip assembly: is the bi-material model acceptable? |
| Author: |
Suhir, Ephraim |
| Appeared in: |
Journal of materials science. Materials in electronics |
| Paging: | Volume 28 (2017) nr. 21 pages 15775-15781 |
| Year: |
2017 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 40 of 103 found articles
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