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Journal description
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Details for article 55 of 100 found articles
| Title: |
Microstructure and mechanical behavior of Sn–40Bi–xCu alloy |
| Author: |
Wu, Xulei Xia, Ming li, Sujie Wang, Xiaojing Liu, Bin Zhang, Jiaoxia Liu, Ning |
| Appeared in: |
Journal of materials science. Materials in electronics |
| Paging: | Volume 28 (2017) nr. 20 pages 15708-15717 |
| Year: |
2017 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 55 of 100 found articles
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