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Journal description
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Details for article 20 of 101 found articles
| Title: |
Cu–Sn and Ni–Sn transient liquid phase bonding for die-attach technology applications in high-temperature power electronics packaging |
| Author: |
Lee, Byung-Suk Hyun, Soong-Keun Yoon, Jeong-Won |
| Appeared in: |
Journal of materials science. Materials in electronics |
| Paging: | Volume 28 (2017) nr. 11 pages 7827-7833 |
| Year: |
2017 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 20 of 101 found articles
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