|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 24 of 152 found articles
| Title: |
Effect of Al on the microstructure and properties of Sn–0.7Cu solder alloy |
| Author: |
Lai, Zhongmin Ye, Dan |
| Appeared in: |
Journal of materials science. Materials in electronics |
| Paging: | Volume 27 (2015) nr. 2 pages 1177-1183 |
| Year: |
2015 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 24 of 152 found articles
| << previous | next >> |