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Journal description
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Details for article 64 of 135 found articles
| Title: |
Influence of the aggregated Ag3Sn on the improvement of electromigration phenomenon in the doped Sn58Bi solder joints |
| Author: |
Sun, Huayu Chan, Y. C. Wu, Fengshun |
| Appeared in: |
Journal of materials science. Materials in electronics |
| Paging: | Volume 26 (2015) nr. 7 pages 5129-5134 |
| Year: |
2015 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 64 of 135 found articles
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