|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 49 of 95 found articles
| Title: |
Investigation on the effect of Sn grain number and orientation on the low cycle fatigue deformation behavior of SnAgCu/Cu solder joints |
| Author: |
Gao, Ruiting Li, Xiaoyan Zhu, Yongxin |
| Appeared in: |
Journal of materials science. Materials in electronics |
| Paging: | Volume 26 (2015) nr. 4 pages 2175-2180 |
| Year: |
2015 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 49 of 95 found articles
| << previous | next >> |