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                                       Details for article 83 of 125 found articles
 
 
  Microstructure and electrical property of copper films on a flexible substrate formed by an organic ink with 9.6 % of Cu content
 
 
Title: Microstructure and electrical property of copper films on a flexible substrate formed by an organic ink with 9.6 % of Cu content
Author: Yang, Wen-dong
Wang, Chang-hai
Arrighi, Valeria
Liu, Chun-yan
Watson, David
Appeared in: Journal of materials science. Materials in electronics
Paging: Volume 26 (2015) nr. 11 pages 8973-8982
Year: 2015
Contents:
Publisher: Springer US, New York
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 83 of 125 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands