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Journal description
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Details for article 65 of 125 found articles
| Title: |
Interfacial reactions between Cu substrate and Sn–1Ag–0.5Cu solder containing 0.1 wt% Al by dipping method |
| Author: |
Shnawah, Dhafer Abdulameer Sabri, Mohd Faizul Mohd Said, Suhana Binti Mohd Jauhari, Iswadi Mahdavifard, Mohammad Hossein Bashir, Mohamed Bashir Ali Elsheikh, Mohamed Hamid |
| Appeared in: |
Journal of materials science. Materials in electronics |
| Paging: | Volume 26 (2015) nr. 10 pages 8229-8239 |
| Year: |
2015 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 65 of 125 found articles
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