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Electroless plating catalyzed by 3D Cu NWs arrays on insulating substrate with enhanced adhesion |
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Titel: |
Electroless plating catalyzed by 3D Cu NWs arrays on insulating substrate with enhanced adhesion |
Auteur: |
Pan, Yi Fan, Shichang Yu, Weichao Wang, Baoyu Zhao, Hengyu Tang, Qize Zhang, Zihao Fang, Bin Zhang, Zhen |
Verschenen in: |
Journal of materials science |
Paginering: |
Jaargang 59 () nr. 21 pagina's 9265-9275 |
Jaar: |
2024-05-22 |
Inhoud: |
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Uitgever: |
Springer US, New York |
Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
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