A nanoclustered ceria abrasives with low crystallinity and high Ce3+/Ce4+ ratio for scratch reduction and high oxide removal rates in the chemical mechanical planarization
Titel:
A nanoclustered ceria abrasives with low crystallinity and high Ce3+/Ce4+ ratio for scratch reduction and high oxide removal rates in the chemical mechanical planarization
Auteur:
Kim, Na-Yeon Kim, Goeun Sun, Hanna Hwang, Uiseok Kim, Junyoung Kwak, Donggeon Park, In-Kyung Kim, Taesung Suhr, Jonghwan Nam, Jae-Do