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Journal description
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Details for article 36 of 60 found articles
| Title: |
Liquid structure of Sn-Ag-xCu solders and its effect on the formation and growth of interfacial Cu6Sn5 |
| Author: |
Zhao, Ning Pan, Xuemin |
| Appeared in: |
Journal of materials science |
| Paging: | Volume 55 () nr. 27 pages 13294-13302 |
| Year: |
2020-06-12 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 36 of 60 found articles
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