|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 39 of 50 found articles
| Title: |
Reverse polarity effect and cross-solder interaction in Cu/Sn–9Zn/Ni interconnect during liquid–solid electromigration |
| Author: |
Huang, M. L. Zhou, Q. Zhao, N. Liu, X. Y. Zhang, Z. J. |
| Appeared in: |
Journal of materials science |
| Paging: | Volume 49 (2013) nr. 4 pages 1755-1763 |
| Year: |
2013 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 39 of 50 found articles
| << previous | next >> |