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                                       Details for article 39 of 50 found articles
 
 
  Reverse polarity effect and cross-solder interaction in Cu/Sn–9Zn/Ni interconnect during liquid–solid electromigration
 
 
Title: Reverse polarity effect and cross-solder interaction in Cu/Sn–9Zn/Ni interconnect during liquid–solid electromigration
Author: Huang, M. L.
Zhou, Q.
Zhao, N.
Liu, X. Y.
Zhang, Z. J.
Appeared in: Journal of materials science
Paging: Volume 49 (2013) nr. 4 pages 1755-1763
Year: 2013
Contents:
Publisher: Springer US, Boston
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 39 of 50 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands