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Journal description
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Details for article 21 of 51 found articles
| Title: |
Influences of grain structure on thermally induced stresses in 3D IC inter-wafer vias |
| Author: |
Bentz, D. N. Bloomfield, M. O. Lu, J.-Q Gutmann, R. J. Cale, T. S. |
| Appeared in: |
Journal of computational electronics |
| Paging: | Volume 5 () nr. 4 pages 327-331 |
| Year: |
2006-12-09 |
| Contents: | |
| Publisher: |
Kluwer Academic Publishers-Plenum Publishers, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 21 of 51 found articles
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