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                                       Details for article 14 of 21 found articles
 
 
  Mechanistic insights into enhanced electroplating of ultra-thin copper foils using ADT-DMAP as a superior acridone-based leveler
 
 
Title: Mechanistic insights into enhanced electroplating of ultra-thin copper foils using ADT-DMAP as a superior acridone-based leveler
Author: Xie, Jingyu
Zhou, Nayun
Ye, Wenlong
Chen, Xin
Wang, Limin
Appeared in: Journal of applied electrochemistry
Paging: Volume 55 () nr. 7 pages 1911-1923
Year: 2025-02-06
Contents:
Publisher: Springer Netherlands, Dordrecht
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 14 of 21 found articles
 
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