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  Cobalt layer prepared on copper using galvanic replacement as an alternative to palladium for activating electroless Ni–P plating
 
 
Title: Cobalt layer prepared on copper using galvanic replacement as an alternative to palladium for activating electroless Ni–P plating
Author: Hu, Guanqun
Li, Rupeng
Liao, Wanda
Bai, Changning
Zhang, Xingkai
Zhao, Qiuping
Zhang, Junyan
Appeared in: Journal of applied electrochemistry
Paging: Volume 55 () nr. 2 pages 395-407
Year: 2024-07-22
Contents:
Publisher: Springer Netherlands, Dordrecht
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

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