|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 5 of 17 found articles
| Title: |
Effect of additives on microstructure and properties of the coarsened layer of very low profile (HVLP) copper foil |
| Author: |
Xiao, Yan Sun, Wan-chang Bai, Zhong-bo Liu, Er-yong Du, Liang-liang Cai, Hui Wang, Li-ping Liu, Jing-pei Jia, Ya-peng Zhang, Jie |
| Appeared in: |
Journal of applied electrochemistry |
| Paging: | Volume 53 () nr. 12 pages 2331-2346 |
| Year: |
2023-06-09 |
| Contents: | |
| Publisher: |
Springer Netherlands, Dordrecht |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 5 of 17 found articles
| << previous | next >> |