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Journal description
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Details for article 10 of 25 found articles
| Title: |
Effects of K4Fe(CN)6 on electroless copper plating using hypophosphite as reducing agent |
| Author: |
Gan, Xueping Wu, Yating Liu, Lei Hu, Wenbin |
| Appeared in: |
Journal of applied electrochemistry |
| Paging: | Volume 37 (2007) nr. 8 pages 899-904 |
| Year: |
2007 |
| Contents: | |
| Publisher: |
Kluwer Academic Publishers, Dordrecht |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 10 of 25 found articles
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