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Journal description
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Details for article 11 of 14 found articles
| Title: |
Electroplating of copper onto a preanodized 7005AlAl2O3{P} metal matrix composite |
| Author: |
JC. Lin WD. Jehng SL. Lee |
| Appeared in: |
Journal of applied electrochemistry |
| Paging: | Volume 33 (2003) nr. 7 pages 9 p. |
| Year: |
2003-07 |
| Contents: | |
| Publisher: |
Kluwer Academic Publishers, Dordrecht, The Netherlands |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 11 of 14 found articles
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