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                                       Details for article 15 of 17 found articles
 
 
  Study of the mechanism of additives on copper dissolution in monoethanolaminecomplexed cupric ion solution
 
 
Title: Study of the mechanism of additives on copper dissolution in monoethanolaminecomplexed cupric ion solution
Author: CW. Shih
YY. Wang
CC. Wan
Appeared in: Journal of applied electrochemistry
Paging: Volume 32 (2002) nr. 9 pages 6 p.
Year: 2002-09
Contents:
Publisher: Kluwer Academic Publishers, Dordrecht, The Netherlands
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 15 of 17 found articles
 
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