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Journal description
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Details for article 5 of 5 found articles
| Title: |
Theoretical and experimental studies of spring-buffer chip peeling technology for electronics packaging |
| Author: |
Hong, Jinhua Chen, Wei Guo, Jinhong Cheng, Peng Li, Yulong Dong, Wentao |
| Appeared in: |
International journal of fracture |
| Paging: | Volume 236 () nr. 1 pages 109-124 |
| Year: |
2022-05-16 |
| Contents: | |
| Publisher: |
Springer Netherlands, Dordrecht |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 5 of 5 found articles
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