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                                       Details for article 9 of 14 found articles
 
 
  Material engineering to enhance reliability in 3D NAND flash memory
 
 
Title: Material engineering to enhance reliability in 3D NAND flash memory
Author: Kim, Ki Han
Kim, Namju
Kim, Yeong Kwon
Kim, Hee Seung
Oh, Han Byeol
Kim, Chae Eun
Shin, Hyeun Woo
Kim, Myeong Gi
Choi, Won Jun
Jang, Byung Chul
Appeared in: Device
Paging: Volume 3 () nr. 2 pages p.
Year: 2025
Contents:
Publisher: Published by Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 9 of 14 found articles
 
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