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Journal description
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Details for article 28 of 41 found articles
| Title: |
Low-temperature interconnection and strengthening mechanism of Cu/Cu joint with SAC particles solders |
| Author: |
Gan, Gui-sheng Huang, Tian Chen, Shi-qi Jiang, Liu-jie Cheng, Da-yong Zhang, Shu-ye |
| Appeared in: |
Memories, materials, devices, circuits and systems |
| Paging: | Volume 4 () nr. C pages p. |
| Year: |
2023 |
| Contents: | |
| Publisher: |
The Author(s) |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 28 of 41 found articles
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