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Journal description
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Details for article 18 of 41 found articles
| Title: |
Fatigue behavior of 3D stacked packaging structures under extreme thermal cycling condition |
| Author: |
Xu, Xin Liu, Yang Su, Yahui Sun, Cong Xue, Yuxiong Ju, Lina Zhang, Shuye |
| Appeared in: |
Memories, materials, devices, circuits and systems |
| Paging: | Volume 4 () nr. C pages p. |
| Year: |
2023 |
| Contents: | |
| Publisher: |
The Author(s) |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 18 of 41 found articles
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