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                                       Details for article 8 of 16 found articles
 
 
  Finite element comparative study on creep and random vibrations of solder joints in BGA package
 
 
Title: Finite element comparative study on creep and random vibrations of solder joints in BGA package
Author: Depiver, Joshua A.
Mallik, Sabuj
Amalu, Emeka H.
Appeared in: Power electronic devices and components
Paging: Volume 11 () nr. C pages p.
Year: 2025
Contents:
Publisher: The Author(s)
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 8 of 16 found articles
 
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