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                                       Details for article 10 of 16 found articles
 
 
  Impact of voids on the solder joint integrity and fatigue life of IGBT power module
 
 
Title: Impact of voids on the solder joint integrity and fatigue life of IGBT power module
Author: Nebo, Sunday E.
Amalu, Emeka H.
Hughes, David J.
Appeared in: Power electronic devices and components
Paging: Volume 11 () nr. C pages p.
Year: 2025
Contents:
Publisher: The Author(s)
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 10 of 16 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands